Micron Enhances NVMe Storage Speed, Performance and Value with All-Flash Ceph Reference Architecture
Micron Technology, Inc., a world leader in advanced semiconductor systems and innovative storage solutions, at this year's OpenStack Summit announced the high-performance, all-flash Ceph storage reference
Winbond Multi-Chip Package (MCP) memories are known for the critical features and functions they bring to designers, including high performance, power efficiency, wide temperature and density ranges, and small package sizes.
Winbond’s product portfolio, including mobile DRAM, specialty DRAM and Code Flash Storage, is widely used by tier-1 customers in consumer, communication, computer peripheral and automotive markets. Download the 2017 Product Selection Guide now!
Micron SolidScale Platform Architecture Promises to Unlock Unused Capacity and Performance of NVMe Storage
Micron Technology, Inc., a global leader in innovative storage solutions including DRAM, NAND, NOR Flash and 3D XPoint™ memory, unveiled its new SolidScale architecture.
Looking back, it’s interesting to see how the storage technology over the past several decades has evolved and adapted to complex computing needs. Learn more about the evolution of storage in the data center.
Studies show that the influx of Big Data has grown exponentially in recent times, almost 9X faster than the conventional IT market. Supermicro, a global supplier of rackmount storage servers, offers excellent storage solutions for cold and warm data.
However, to effectively accumulate, analyze, and share relevant data requires memory solutions that are specially optimized to leverage fast processing throughput for Big Data. Memory and storage are crucial when it comes to handling Big Data.
Just before the end of day two at Game Developers Conference (GDC) 2017 in San Francisco in March, NVIDIA, a global leader in premium quality graphics processing units (GPUs) for the gaming market, unveiled their new high-end graphics card.
Micron's NOR Flash easy to implement memory solution offers faster boot with minimal management due to its inherent cell structure, specially designed to deliver industry-leading speed and performances at reduced operational costs.
The waves of IoT-enabled devices, applications, and automation is triggering the dawn of a new era — the Internet of Everything — the next level in connected technology.