Abracon, a leading manufacturer of premium-grade frequency control and signal conditioning components, introduces the ARTXXX-IC Series of passive UHF RFID tags designed for use on multiple surface materials including metal.
Understandably, the essentials of storage standards are being pushed by unprecedented characteristics like easy integration, sleek packaging size, low power, and high-density interface.
Micron's revolutionary 3D NAND technology allows for 3x the capacity of planar NAND in vertically tiered compact die. The advancement allows our 1100 SSD to be offered in 1TB M.2 and 2TB 2.5in capacities for power and client computing.
Micron has developed an industrial microSD card to address the growing challenges of temperature, endurance and robust requirements that consumer or wireless memory solutions can’t meet.
Today's users expect response times to be faster than ever. They want their applications to respond instantly, but in order to do that, applications require more compute cores, more memory, storage, and faster server processors.
With significant advantages over DDR3, DDR4 SDRAM has emerged as the near-perfect solution to fill the needs of the current and future hardware and software architectures yet its adoption hasn’t been as widespread as it should have been.
Micron Enhances NVMe Storage Speed, Performance and Value with All-Flash Ceph Reference Architecture
Micron Technology, Inc., a world leader in advanced semiconductor systems and innovative storage solutions, at this year's OpenStack Summit announced the high-performance, all-flash Ceph storage reference
Winbond Multi-Chip Package (MCP) memories are known for the critical features and functions they bring to designers, including high performance, power efficiency, wide temperature and density ranges, and small package sizes.
Winbond’s product portfolio, including mobile DRAM, specialty DRAM and Code Flash Storage, is widely used by tier-1 customers in consumer, communication, computer peripheral and automotive markets. Download the 2017 Product Selection Guide now!
Micron SolidScale Platform Architecture Promises to Unlock Unused Capacity and Performance of NVMe Storage
Micron Technology, Inc., a global leader in innovative storage solutions including DRAM, NAND, NOR Flash and 3D XPoint™ memory, unveiled its new SolidScale architecture.