Pseudo SRAM (PSRAM) devices are experiencing a design revival with the adoption of wearable devices. Also known as CellularRAMTM, PSRAM were widely used in feature mobile phones. A typical IoT wearable design requires low power for extended battery life.
Winbond Electronics Corporation, leading supplier of semiconductor solutions for consumer, computer, communications and electronics products markets, announces their 25Q Serial Flash memory family, including the W25Q256JW (256M-bit).
A security feature of Winbond W74M devices involves a multi-layer authentication process. Authentication is performed as needed and is initiated by the host. Use standard serial flash to easily upgrade their system security using the same footprint.
Micron's new 9200 NVMe SSDs integrate the cost-efficient capacity of 3D NAND with the proven throughput and response time of the NVMe protocol. The SSDs, built from the ground up, unleash high performance, industry-leading speed.
Micron’s new 9200 series of NVMe SSDs is the company’s flagship performance family and the second generation of NVMe drives!
Micron Technology, a global leader in innovative memory and storage solutions, organized an experiment to compare two MongoDB test clusters: the legacy three-node cluster and the 5100 ECO three-node cluster using the Linux® Logical Volume Manager.
Micron, a global leader in memory and semiconductor technology, has introduced the 5100 Series SATA SSD with the industry's highest capacity of up to 8TB and a steady state random writes up to 74,000 IOPS.
Abracon, a leading manufacturer of premium-grade frequency control and signal conditioning components, introduces the ARTXXX-IC Series of passive UHF RFID tags designed for use on multiple surface materials including metal.
Understandably, the essentials of storage standards are being pushed by unprecedented characteristics like easy integration, sleek packaging size, low power, and high-density interface.
Micron's revolutionary 3D NAND technology allows for 3x the capacity of planar NAND in vertically tiered compact die. The advancement allows our 1100 SSD to be offered in 1TB M.2 and 2TB 2.5in capacities for power and client computing.