Winbond’s MCP Memories and Their Use in Telematics

By WPG AmericasJune 15, 2017

Winbond Multi-Chip Package (MCP) memories are known for the critical features and functions they bring to designers—including high performance, power efficiency, wide temperature and density ranges, and small package sizes— for a wide range of rugged applications. One such application which we will be looking into is the automobile industry, and more specifically – telematics.

The State of the Telematics Market

The role of telematics control unit (TCU) is increasingly gaining momentum in the automotive sector with various use cases encompassing the emerging concept of connected vehicles. A TCU, typically used to transmit crucial data to the cloud, enables smart features that make today's connected cars safe and secure.

The accelerated emergence of connected vehicles, forecasted to hit 220 million units by the end of 2020, is driving the embedded telematics market that is currently estimated to be growing at a CAGR of 45%. In addition, there’s a huge aftermarket for telematics, which can evolve into a multi-billion dollar business in the coming years. In fact, the aftermarket telematics segment is witnessing growth at a CAGR of 34%.

The deployment of telematics control units, in the past few years, has been restricted to automatic vehicle-initiated emergency calls, fleet management, concierge services, in-vehicle conference call service, and car diagnostics, such as the vehicle health information.

However, in recent times, car manufacturers have started broadcasting over the air (OTA) software updates for in-vehicle electronic control modules, delivered directly to the connected vehicles. Nonvolatile, reprogrammable NAND flash memory plays a vital role as an interim storage location for these over the air software updates before it is forwarded to the relevant in-vehicle electronic control module.

Winbond MCP Memories in Telematics Applications

Winbond Electronics Corporation, a Taiwan-based corporation, is one of the world’s leading manufacturer of superior quality semiconductors and a variety of integrated circuits, particularly Dynamic RAM, Static RAM, and microcontrollers.

Winbond’s MCP memory devices, qualified for automotive grade, integrate two low power devices, 1.8V NAND, and SDRAM in a single package. This unique combination of storage variants offers high endurance, superb data integrity, and high performance in smart automotive applications.

Key Features of Winbond Multi-Chip Package Memories

Winbond’s product family of Multi-Chip Package memories is ideal for IoT connected devices at the edge, such as a vehicle that requires connectivity to the cloud.

The W71NW, an MCP device from Winbond, features combined memory functionalities in a single package. This storage product family integrates a low-power SDRAM device and a 1.8V NAND flash memory in a single, convenient VFBGA package.

Winbond’s 1Gbit x 16 bit W29N01GW NAND flash memory device has an unmatched 100k erase/program cycle endurance with data retention capabilities up to ten years.

The 512Mbit low-power W949D6KK DDR SDRAM has been developed with both power down as well as Deep Power Down (DPD) modes and includes clock stop functions for maximum power savings during idle periods.

Cutting-edge features like Auto Temperature Compensated Self Refresh (ATCSR) and Partial Array Self Refresh (PASR) optimize power when the device is in operation.

Winbond MCP memories deliver high-performance in automotive applications that require superior endurance and data integrity even in extreme conditions. The industry-leading MCP devices also offer great advantages by saving a substantial amount of board area in space-critical applications, as they require only one package instead of two.

For more information about Winbond’s products and MCP memory, please contact a WPGA Memory Specialist.