Motor-Driver PCB Layout Guidelines - Part 2

By WPG AmericasAugust 27, 2017

In part 2 of this series, Monolithic Power System's Senior Technical Marketing Engineer Pete Millett explores the best PCB-layout practices for a variety of motor-driver package types.

Part 1 of this article provided some general recommendations for designing printed-circuit boards (PCBs) using motor-driver ICs, which require careful PCB layout for proper performance. Read Part 1 now! Both articles were originally published at

Motor-Driver PCB Layout Guidelines - Part 2

Layout for Lead Packages

6. SOT-23 and SOIC packages are typically used in low-power motor drivers.

Standard leaded packages, like SOIC and SOT-23 packages, are often used for low-power motor drivers (Fig. 6).

To maximize the power-dissipation capability of leaded packages, Monolithic Power Systems uses a “flip-chip on leadframe” construction (Fig. 7). The die is bonded to the metal leads using copper bumps and solder without the use of bond wires. This allows heat to be conducted from the die through the leads to the PCB.

To read the full Motor-Driver PCB Layout Guidelines - Part 2, download the PDF now!